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3D chip stacking tech competition intensifying

Rodney Chan

2023年5月9日

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking.

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking. TSMC said SoIC-P complements its existi… https://www.digitimes.com/news/a20230508PD223/tsmc-3d-soic-ic-manufacturing.html




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